By Alphonsus Pocius
This booklet describes, in transparent comprehensible language, the 3 major disciplines of adhesion know-how: mechanics of the adhesive bond, chemistry of adhesives, and floor technological know-how. a few wisdom of actual and natural chemistry is believed, yet no familiarity with the technological know-how of adhesion is needed. The emphasis is on figuring out adhesion, how surfaces may be ready and changed, and the way adhesives will be formulated to accomplish a given activity. in the course of the ebook, the writer offers a huge view of the sector, with a constant sort that leads the reader from one step to the following in gaining an figuring out of the technology.
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Additional info for Adhesion and Adhesives Technology 3E
8 Summary In this chapter, we have defined and examined many of the materials properties that are used as a basis for discussion in future chapters. In particular, we defined important quantities such as the Young’s and shear moduli, the Poisson’s ratio, the strain energy and the critical strain energy release rate. The properties of liquids were also examined and the viscosity was defined. Descriptions were given of characteristics of liquids under varying shear rates. Important viscoelastic parameters were defined such as the storage and loss moduli.
Elasticity means that when load is removed from the material, it returns to its original shape and size without the loss of mechanical energy as heat. The factor E is known as the tensile modulus or Young’s modulus of the material in test. 49 Young’s modulus has the units of stress, Pascal (Pa) in SI units and pounds per square inch (psi) in English units. Since the above equation, σ = E expresses the relation between the stress and strain rather than force and displacement, Young’s modulus is a materials parameter describing how a material reacts to a given tensile force.
With two test methods, the analysis of the bending of beams is used to examine the stress state in the adhesive as well as the adherend. The analysis shows that certain types of loading of adhesive bonds are to be avoided, if at all possible. It should be cautioned that this book is not a designer’s guide. We hope to provide a useful discussion as to how adhesive bond specimens may be prepared and what fundamental information about the performance of adhesives can be gained. Considerable text is devoted to examination of adhesive bond tests described in the literature of the American Society for Testing and Materials (ASTM) .